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Processing

宣布时候: 2016/08/03 08:50,种别: Product

Self-developed key technologies for silicon carbide ingot & wafer processing: select the appropriate abrasive materials and appropriate processing recipe to slice, grind, polish and CMP silicon carbide ingots & wafers, obtained good flatness and surface quality silicon carbide wafers which are applicable for the use of epitaxial and device customers.

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